Internship fibre reinforced HPP

Full Time, Enschede The Netherlands

Home>Join Bond>Internship heat conduction HPP

Bond3D is developing a 3D FDM printer for high performance polymers such as PEEK. The printer is designed for products in demanding medical and industrial applications.

Tasks

Bond3D is developing a 3D FDM printer for high performance polymers such as PEEK. The printer is designed for products in demanding medical and industrial applications. Key product features are 100% volume infill and isotropic high strength. Bond3D is participating in the EFRO project “Fast3D” for the continuous development of innovative 3D printing technology.

One of the project goals is to develop a high performance printing process for the use of filled HPP grades. An internship is available on the subject of filled high performance polymers (HPP), focussing on fibre reinforced material. Fibre reinforced HPP is used for applications where a very high mechanical strength is needed.

  • Investigate the influence of filled HPP on printing behaviour
  • Test the influence of filled HPP on mechanical behaviour
  • Design optimization between strength and weight

What to expect?

  • You are studying a technical Master degree e.g. Mechanical Engineering, Physics, Aerospace Engineering, Applied mathematics
  • English language fluency in speaking and writing;
  • Affinity with programming (in e.g. python) and data analysis techniques
  • Ability to work on a project independently
  • Eager to gather in-depth knowledge about several aspects of additive manufacturing
  • Perform practical research in combination with theoretical background

Solliciteer nu!

Spreekt High Tech jou aan? En een omgeving waarin multidisciplinair inzicht vanzelfsprekend is? Grijp jij zo’n technische uitdaging met beide handen aan en wil jij samen met jouw collega’s aan de slag om hiervoor concepten te ontwikkelen? Grijp dan nu je kans en ga aan de slag bij Bond3D en lever een belangrijke bijdrage aan de ontwikkeling van deze revolutionaire printer.

Stuur dan je motivatiebrief en CV naar: Bond3D t.a.v. Arry Wegdam, via recruitment@bond3d.com.

Share our vacancy