Bond3D - High Performance 3D Technology
3D printed PEEK parts for the electronics and semiconductor industry2023-12-13T16:55:03+02:00
PEEK for the electronics and semiconductor industry


Pressure tight parts for semiconductor production

3D printed PEEK parts for the electronics and semiconductor industry

Significant trends as mobile computing, internet-of-things and autonomous driving are pushing the electronics market, production of small volume high performance machine parts for manufacturing industry such as the semiconductor, to significant growth levels.

Industries providing the infrastructure for this demand are challenging ‘Moore’s law’ on a daily basis. Within this challenge performing materials such as PEEK are often recognized as a valuable material enabling new solutions.

Bond3D allows players in this field to work with 3D printed performing solutions of high performing plastics. Bond3D has experience in the electronic industry and understands the requirements of parts operating specifically in high vacuum environments.

Critical parts made from PEEK for the electronic and semiconductor industry

These parts can change your industry

3D Printed Cooling Manifold for the electronics and semiconductor industry

PEEK Cooling Manifold for the electronics industry

Cooling fluid is distributed by this flow-optimized manifold, simultaneously saving weight and enhancing production output.

  • Leak-tight manufacturing
  • Reduce parts
  • Low weight
  • Optimized flow


Manifold for semiconductor

The semiconductor industry uses a variety of fluid manifolds, which are perfect for the Bond3D leak-tight technology and PEEK material.

  • Leak-tight manufacturing
  • Reduce parts
  • Low weight
  • Optimized flow

Bond3D PEEK Wafer Holder

Wafer Holder

Custom developed wafer holder that’s chemical resistant. As milling is not an option, this part is 3D Printed with PEEK Polymers to reduce the amount of material and save weight.

  • Chemical resitant

  • Low weight
  • Inline printed

Why choose PEEK polymers for electrical components?

PEEK’s excellent electrical properties make it an ideal insulator. With excellent thermal properties, PEEK polymer components can withstand high temperatures that conventional insulation cannot withstand. These benefits, along with long-term reliability, temperature, pressure, and frequency stability, make them suitable for use in subsea environmental control equipment or high-pressure pump terminal pins.

PEEK can maintain good electrical insulation even under harsh working conditions such as high temperature, high pressure and high humidity. Therefore, the application field of PEEK resin is gradually changing to the field of electronic and electrical appliances. PEEK resin has high purity and stable mechanical and chemical properties, which reduces contamination when processing silicon wafers.

PEEK resin does not deform over a wide temperature range and can be used to manufacture parts that can withstand the high temperatures of heat welding. Due to this property, PEEK resin is commonly used in the semiconductor industry to produce wafer carriers, electronic insulating sheets, various connecting devices, as well as wafer carrier insulating sheets, connectors, printed circuit boards, high temperature connectors, etc.

PEEK resins can also be used in µg/L ultrapure water handling and storage equipment such as pipes, valves, pumps and positioners. PEEK is already used in Japan and other countries in the manufacture of large scale integrated circuits. PEEK is used in plug-in connectors, high reliability connectors, cable connectors, junction boxes, distribution lines, plate cage coils, battery cases, IC packaging, the semiconductor industry, and other electronic and electrical applications in fittings and valves for ultrapure water systems. It can also be used in fields. Required in ultrapure industry and other components.

The advantages of PEEK high-performance polymers for the semiconductor industry.

3D printing of high-performance polymers overcomes the restrictions of conventional manufacturing. It opens up a whole new world of design and production possibilities while optimizing your Cost of Goods.


Bond3D parts from PEEK are voidless and very well suited for complex structures that manage fluids and gas. Our printed parts can be pressurized to 100+ BAR.


PEEK is up to three times lighter than titanium and 40% lighter than aluminum. Bond3D printing further enhances PEEK with weight-optimized designs.

Complex structures

Design and print strong functional parts with complex structures, like manifolds, which would be impossible to create with conventional methods.

High vacuum environment

Peek is very suited for cleanroom applications. Thanks to its low outgassing it is very useful in high vacuum environments.

High mechanical strength

PEEK printed with Bond3D technology has a high mechanical strength of 95MPa, which is close to the base-material properties.

Chemical resistant

PEEK is resistant to almost any chemical, making it the perfect material for demanding applications.

Lower failure rate

Simplify designs to reduce the failure rate and optimize up-time by reducing weak spots in designs.

Fast time to market

Fast development, rapid prototyping, and short lead times ensure fast delivery.

Function integration

Integrate multiple parts into one, i.e. manifolds with cable routing.

Large temperature range

PEEK parts can withstand temperatures from – 40 C up to + 250 C.

Bond3D PEEK Cooling Manifold

“Because of the leak-tight properties, 3D printed manifolds are an important part of our core business. It’s a critical application for the racing- and semiconductor industry where higher output or more efficient machines are essential” says Marc Kunst.

The application team at Bond3D can provide you with right analysis by checking how you can replace your conventional metal cooling manifolds with 3D Printed PEEK cooling manifolds

Re-design of the Cooling Manifold

Bond3D | Cooling Manifold
Bond3D | Cooling Manifold
Bond3D | Cooling Manifold
Bond3D | Cooling Manifold

3D Printed by Bond3D

  • 8 times lighter than original

  • Leak tight

  • Certified 450G PEEK

  • Less heat absorption by manifold

  • Less heat absorption by manifold

  • Improved flow

  • Chemical resistance to most chemicals

  • Operating temperature up to 250°C


  • Higher machine output

  • Robust AM polymer solution

  • Engineer with a known material

  • Better performance

  • Less turbulance, residue, dead water

  • High service time

  • Wider usage

Frequently asked questions about printing PEEK polymers for the electronics market

How are Polymeric materials in the semiconductor industry?2023-05-19T11:28:09+02:00

The semiconductor industry propels countless systems and products essential to our lives, including those we use for work, communication, travel, entertainment, and more. Semiconductors, also known as integrated circuits (ICs) or microchips, have been instrumental in driving progress in various fields like communications, transportation, and clean energy. However, as the pace of innovation quickens, semiconductor manufacturers are tasked with tackling complex challenges and achieving crucial goals​​. Read more…

How does additive manufacturing help the semiconductor industry?2023-02-20T11:45:23+02:00

Additive manufacturing allows you to build parts – for example a fluid manifold or a cooling structure – that is prioritizing function over manufacturing capability. By 3D printing parts with PEEK polymers you’ll end up with smooth channels or channels that don’t take right angle bends that could cause fluid disturbance.

Are PEEK 3d printed parts suitable for the semiconductor industry?2023-02-20T11:41:29+02:00

High-performance polymers, or HPPs, are an important part of the semiconductor industry. Semiconductors go through three stages: making, testing, and assembly, and HPPs are used in all of them. For example, HPPs are used to make parts of wet benches, which are machines that clean, rinse, and dry wafers at high temperatures. HPPs are also used for many other things, like CMP rings, wafer carriers and holders, wafer guides/combs, burn-in test sockets, probe cards, and fasteners. And because of new ways of making things, high-temperature HPPs are becoming more popular for making IC handling trays, spin chucks, and other products.

Are polymeric materials suitable for the semiconductor market?2023-02-20T11:34:28+02:00

PEEK polymeric materials have a broad application in the semiconductor industry, especially when high temperatures and chemical cleaning processes are involved. These polymers perform well under extremely harsh conditions, yet they cost relatively less than materials such as ceramics or quartz.

High Performing Polymers can be utilized in a broad range of markets


3D printed parts certified for the medical market.

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We believe transforming manufacturing is a team effort. Let’s get in touch and discuss how we can help you take the next step.

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