PEEK for the electronics and semiconductor industry

How to leverage polymeric materials in the semiconductor industry

PEEK 3D printed parts solve a lot of challenges

Overcoming Semiconductor Industry Challenges Polymeric with High-Performance Polymer Products

The semiconductor industry propels countless systems and products essential to our lives, including those we use for work, communication, travel, entertainment, and more. Semiconductors, also known as integrated circuits (ICs) or microchips, have been instrumental in driving progress in various fields like communications, transportation, and clean energy. However, as the pace of innovation quickens, semiconductor manufacturers are tasked with tackling complex challenges and achieving crucial goals​​.

Key challenges include reducing leachables, friction, and contamination, extending product lifespan, decreasing wear, enhancing sealability, minimizing stick-slip, and simplifying design​2​. This is where high-performance polymer products for the semiconductor industry, like those created with 3D printing with PEEK (PolyEther Ether Ketone), come into play.

Critical parts made from PEEK for the electronic and semiconductor industry

These parts can change your industry

3D Printed Cooling Manifold for the electronics and semiconductor industry

PEEK Cooling Manifold for the electronics industry

Cooling fluid is distributed by this flow-optimized manifold, simultaneously saving weight and enhancing production output.

  • Leak-tight manufacturing
  • Reduce parts
  • Low weight
  • Optimized flow


Manifold for semiconductor

The semiconductor industry uses a variety of fluid manifolds, which are perfect for the Bond3D leak-tight technology and PEEK material.

  • Leak-tight manufacturing
  • Reduce parts
  • Low weight
  • Optimized flow

Bond3D PEEK Wafer Holder

Wafer Holder

Custom developed wafer holder that’s chemical resistant. As milling is not an option, this part is 3D Printed with PEEK Polymers to reduce the amount of material and save weight.

  • Chemical resitant

  • Low weight
  • Inline printed

The Power of High-Performance Polymer Products

Semiconductors, containing tens of billions of transistors on a small silicon piece, are paving the way for groundbreaking technologies such as brain-inspired computing, virtual reality, and artificial intelligence. The future holds immense potential for semiconductors, and to tap into this potential, high-quality, high-purity materials are indispensable​​.

The semiconductor industry heavily depends on high-performance materials like thermoplastics, elastomers, and fluoroelastomers for a variety of applications. These applications range from chemical mechanical polishing (CMP) to wet cleaning, surface preparation, etching, vacuum pumps, wafer handling, electroplating, deposition, and valves​​.

Products manufactured using high-performance polymer products for the semiconductor industry are diverse and include Optiseals, Chemical Delivery Unit Seals, Filtration Cartridges, Valve Seals, Pump Seals, Flow Controller Seals, Sight Glass Seals, and Heat Transfer Equipment Seals​.

PEEK parts for semiconductor applications

The semiconductor industry sets forth rigorous standards and demanding specifications aimed at ensuring optimal chemical resistance, thermal stability, and plasma resistance. To collaborate with the industry’s frontrunners, manufacturers of polymer products are required to provide top-tier materials and compounds, frequently centered around high-performance polymers like PEEK.

PEEK polymers, owing to their advanced properties, offer a range of concrete advantages. They can help decrease the frequency of wet or mechanical cleaning, lower the cost of consumables, increase the mean time between failures (MTBF), and enhance the overall system uptime.


Bond3D parts from PEEK are voidless and very well suited for complex structures that manage fluids and gas. Our printed parts can be pressurized to 100+ BAR.


PEEK is up to three times lighter than titanium and 40% lighter than aluminum. Bond3D printing further enhances PEEK with weight-optimized designs.

Complex structures

Design and print strong functional parts with complex structures, like manifolds, which would be impossible to create with conventional methods.

High vacuum environment

Peek is very suited for cleanroom applications. Thanks to its low outgassing it is very useful in high vacuum environments.

High mechanical strength

PEEK printed with Bond3D technology has a high mechanical strength of 95MPa, which is close to the base-material properties.

Chemical resistant

PEEK is resistant to almost any chemical, making it the perfect material for demanding applications.

Lower failure rate

Simplify designs to reduce the failure rate and optimize up-time by reducing weak spots in designs.

Fast time to market

Fast development, rapid prototyping, and short lead times ensure fast delivery.

Function integration

Integrate multiple parts into one, i.e. manifolds with cable routing.

Large temperature range

PEEK parts can withstand temperatures from – 40 C up to + 250 C.

Bond3D used manufacturing process for semiconductor applications

Given the critical nature of components and products for semiconductor applications, their manufacturing must adhere to the highest standards of safety, quality, and reliability. At Bond3D, we offer more than just production through our vertically integrated manufacturing process. Our expert team of machinists, operators, and technicians leverage over 30 polymer manufacturing processes and state-of-the-art technology to craft the finest quality seals, wear products, and functional components.

Our design and development team, backed by extensive research, testing, and manufacturing capabilities, frequently collaborate with our customers. This partnership allows us to design performance polymer products tailored to meet unique application specifications and environmental conditions.

3D Printed by Bond3D

  • 8 times lighter than original

  • Leak tight

  • Certified 450G PEEK

  • Less heat absorption by manifold

  • Less heat absorption by manifold

  • Improved flow

  • Chemical resistance to most chemicals

  • Operating temperature up to 250°C


  • Higher machine output

  • Robust AM polymer solution

  • Engineer with a known material

  • Better performance

  • Less turbulance, residue, dead water

  • High service time

  • Wider usage

Talk to us

We believe transforming manufacturing is a team effort. Let’s get in touch and discuss how we can help you take the next step.