3D printing Polymers for Semiconductor industry

3D printing High Performance Polymers for the Semiconductor industry

PEEK is a well accepted solution in Semiconductor industry for the most demanding environments. We combine the benefits of PEEK as a high performance polymer, with the freedom of design and advantages of 3D printing. We are more than willing to explain what our technology has to offer you.

Discover how others successfully make use of Bond3D

Bond3D is one of the few companies in the AM extrusion deposition area that approached the development of their unique system in a systematic, rigorous, and scientific way. It is a pleasure to work with the Bond3D team and strengthen their insights into the process and material. The quality and accuracy of their process and parts is unique and stands out from all other AM technologies.

Oana Ghita Professor in Materials and Manufacturing

University of Exeter

The advantages of 3D printing High Performance Polymers

Use the advantages of 3D printing High Performance Polymers and overcome the restrictions of conventional techniques which allow to optimize your design and Cost of Goods even further.

Complex structures

The Bond3D technology allows to design and print strong functional parts as manifolds with complex structures, impossible to create with conventional techniques

Lower failure mode

Simplify designs to reduce the failure mode, or lower failure mode by reducing weak spots in designs

Void less

PEEK printed with the Bond3D technology is void less and therefore very well suited for fluid and gas management which require complex structures.

Chemical restitance

PEEK has a high resistance to almost any chemical making it a good fit for demanding applications

Fast time to market

Short development & production lead times with Bond3D technologies enabling a fast delivery

Function integration

Integrate multiple parts into one, conbine functional parts with e.g. cable routings

Lower failure mode

Simplify designs by printing to reduce the failure mode, or lower failure mode by reducing and optimizing weak spots in designs

Large temperature range

PEEK parts can withstand temperatures from -40C to 250C

High mechanical strength

PEEK printed with Bond3D technology has high mechanical strength with 95MPa which is close to virgin material values

Fast proto typing& iterations

Quickly develop and produce proto’s and iterate them digitally to save costs

Air and helium leak thight

Due to the void less structure after printing, Bond3D printed PEEK is leak tight and can be pressurized

Lightweight & reduced density

PEEK as virgin material is up to three times lighter then titanium an 40% lighter then aluminium. The Bond3D technology can even further enhance PEEK with 3D designs for weigh reduction and the possibility to add complex internal and porous structures.

High vacuum environment

Due to its specific characteristics PEEK is well usable in cleanroom grade applications

RGA approved for vacuum

Due to the low outgassing values PEEK is very useful in (high)vacuum environments

Examples of Bond3D in practice

Bond3D technology offers printed PEEK with the strength of virgin material. Due to our technique we can optimize designs, integrate functions into a single part and create chemical resistant and leak tight solutions that can be used in ultra high vacuum. PEEK can be used as a substitute for other high performance polymers and replace titanium or aluminum in several applications for enhanced performance and lower weight. Apart from printing PEEK, Bond3D can print many other High Performance Polymers with similar benefits.

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Complex structures

The Bond3D technology allows to design and print strong functional parts as manifolds with complex structures, impossible to create with conventional techniques

Lower failure mode

Simplify designs to reduce the failure mode, or lower failure mode by reducing weak spots in designs

Void less

PEEK printed with the Bond3D technology is void less and therefore very well suited for fluid and gas management which require complex structures.

Chemical restitance

PEEK has a high resistance to almost any chemical making it a good fit for demanding applications

Fast time to market

Short development & production lead times with Bond3D technologies enabling a fast delivery

Function integration

Integrate multiple parts into one, conbine functional parts with e.g. cable routings

Lower failure mode

Simplify designs by printing to reduce the failure mode, or lower failure mode by reducing and optimizing weak spots in designs

Large temperature range

PEEK parts can withstand temperatures from -40C to 250C

High mechanical strength

PEEK printed with Bond3D technology has high mechanical strength with 95MPa which is close to virgin material values

Fast proto typing& iterations

Quickly develop and produce proto’s and iterate them digitally to save costs

Air and helium leak thight

Due to the void less structure after printing, Bond3D printed PEEK is leak tight and can be pressurized

Lightweight & reduced density

PEEK as virgin material is up to three times lighter then titanium an 40% lighter then aluminium. The Bond3D technology can even further enhance PEEK with 3D designs for weigh reduction and the possibility to add complex internal and porous structures.

High vacuum environment

Due to its specific characteristics PEEK is well usable in cleanroom grade applications

RGA approved for vacuum

Due to the low outgassing values PEEK is very useful in (high)vacuum environments

Examples of Bond3D in practice

Bond3D technology offers printed PEEK with the strength of virgin material. Due to our technique we can optimize designs, integrate functions into a single part and create chemical resistant and leak tight solutions that can be used in ultra high vacuum. PEEK can be used as a substitute for other high performance polymers and replace titanium or aluminum in several applications for enhanced performance and lower weight. Apart from printing PEEK, Bond3D can print many other High Performance Polymers with similar benefits.

PRESSURE-CONTROLLED VOIDLESS PEEK PRINTING

  • Download “PRESSURE-CONTROLLED VOIDLESS PEEK PRINTING”
  • High-performance polymers such as PEEK are difficult to print; it is hard to ensure that the properties of printed parts approach those of bulk material. Bond High Performance 3D Technology, however, has succeeded in developing a unique 3D-printing technology – including system mechatronics, software, slicing technology and process validation – for producing high-endfunctional parts from PEEK
  • Bond 3D’s patented technology is capable of printing complex, functional parts made of PEEK with excellent mechanical properties, including in the z-direction. This enables the additive manufacturing of high-strength,isotropic parts with properties comparable to those of conventionally moulded or machined PEEK parts, while allowing for freedom in design and complex structures that are not possible using conventional techniques.
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