Significant trends as mobile computing, internet-of-things and autonomous driving are pushing the electronic market, production of small volume high performance machine parts for manufacturing industry such as the semiconductor, to significant growth levels. Industries providing the infrastructure for this demand are challenging ‘Moore’s law’ on a daily basis. Within this challenge performing materials such as PEEK are often recognized as a valuable material enabling new solutions.
Bond3D allows players in this field to work with 3D printed performing solutions of high performing plastics. Bond3D has experience in the electronic industry and understands the requirements of parts operating specifically in high vacuum environments.